The third Hong Kong Science Fair: leveraging its mega platform to nurture young innovation and technology talent in the city

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  • The Hong Kong Science Fair has provided an immersive platform for young local I&T talent to showcase their inventive prowess
  • Event has also contributed to promoting I&T culture in the city by featuring family-friendly interactive zones and advanced inventions by local science institutions on display
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The third Hong Kong Science Fair served as a mega showcase for local young innovation and technology talent. It also helped promote a culture of science and tech in the community. Photo: Handout

Organised by the Hong Kong Innovation Foundation (HKIF), the Hong Kong Science Fair (HKSF) is a grand platform for local Innovation and Technology (I&T) talent to shine. It also propels the Gold Award-winning teams onto the international stage by sponsoring their entry into the prestigious International Exhibition of Inventions Geneva.

This vibrant event has evolved into an established nurturing ground for student participants. It offers a comprehensive and transformative experience that guides them from problem identification to solution development and the creation of hardware prototypes. The event also hones their communication skills through interactions with judges and visitors. Teamwork is emphasised, as is harnessing the unique strengths of each group member to optimise projects.

Attracting a record 30,000-strong attendance this year, the bustling HKSF was teeming with visitors of all ages and nationalities, engaging with the participating teams. Many were amazed by the innovative solutions on display. Meanwhile, enthusiastic student participants invited visitors to their prototype demonstrations and handed out souvenirs.

The air was charged with excitement, as the teams knew that the HKIF would once again sponsor the Gold Award winners to participate in the Geneva exhibition in Switzerland.

Two Hong Kong student teams win bronze awards for AI, floating greenhouse projects at the International Exhibition of Inventions Geneva in Switzerland

Visitors were equally enthusiastic, casting their votes for their favourite inventions for the Most Popular Award. A large crowd was thrilled to pose next to the cutting-edge technological innovations showcased by local institutes.

Professor Sun Dong, JP, secretary for innovation, technology and industry of the HKSAR Government, attended the award ceremony as the guest of honour. Meanwhile, the Director General of the Youth Department of the Liaison Office of the Central People’s Government in the HKSAR, Zhang Zhihua, supported the event by attending the ceremony.

Professor Sun said, “The Hong Kong Science Fair, through the competition format, encourages students to apply science to address real-life challenges with an innovative and people-oriented approach. The government has been making substantial efforts to promote STEM education, and promotion by the community is also crucial.”

“The Science Fair serves as a commendable demonstration of how community-driven initiatives can promote the popularisation of science and technology. The enthusiastic participation and vibrant atmosphere on-site indicate the success of this well-received science event.”

Professor Sun Dong (fourth from right), Zhang Zhihua (first from right), and Dr Daryl Ng (second from right) visited the Gold Award-winning team in the Primary Division from Ng Clan’s Association Tai Pak Memorial School. Photo: Handout

Echoing Professor Sun’s view, Daryl Ng, SBS, JP, chairman of the HKIF, expressed his gratitude for the public support. “We are delighted that the HKSF has received widespread support and participation and is able to play a role in inspiring the I&T journey of young innovators,” he said.

“I noticed that many parents participated in the event with their children, aiming to nurture their interest and capability in I&T. I look forward to seeing these young people utilise technology and an innovative mindset to contribute to society in the future, injecting fresh vitality into Hong Kong’s I&T ecosystem,” he added.

Professor Sun Dong (fourth from right in the second row), Zhang Zhihua (fifth from right in the second row), Dr Daryl Ng (third from right in the second row), and David Taji-Farouki, president of the jury at the Geneva exhibition (second from right in the second row) and other members of the Hong Kong Science Fair judging panel pose with the winning teams of the Most Popular Award. Photo: Handout

The winning projects showcased the young inventors’ creativity, insightful observations, and superior problem-solving abilities. For instance, the Gold Award winner in the Junior Secondary Division, a team from Pui Shing Catholic Secondary School, wowed the judges with a device designed to assist the elderly with health issues in dressing.

The team was overjoyed at the prospect of stepping onto an international platform by participating in the Geneva exhibition, and team member Tsui Wai-shun expressed their eagerness to exchange ideas with global I&T professionals and start-ups. Despite some jitters, the team plans to enhance its communication and presentation skills in preparation for the exhibition. It aims to improve its invention’s viability by reducing its size, strengthening its structure, and refining its presentation for precision and persuasiveness.

Wai-shun, who has never travelled outside Asia, also sees this as a great opportunity for cultural exposure.

Constructive feedback

The HKSF consistently draws a crowd of professionals eager to explore student projects and offer constructive advice.

The team from Singapore International School (Hong Kong) was ecstatic when a top executive of Hong Kong’s railway system visited their booth. He was intrigued by their “Smart Anti-Flooding Environment (SAFE)” project, designed to protect metro system entrances. “The executive suggested we enhance our project with hydropower for improved sustainability,” shared team member Julian Chan Yat-chun. Their engaging model and lively demonstration won them the Most Popular Award in the Primary Division.

Primary student Wong Lok-sum, a second-time participant from C & M A Chui Chak Lam Memorial School, summed up her experience by saying, “I’m thrilled to see growing interest in Hong Kong’s innovation and technology scene.”

The team from C & M A Chui Chak Lam Memorial School won the Bronze Award in the Primary Division. Photo: Handout

Another stand-out was “Aiya”, an AI chatbot created by Tang Man-hei from Christian Alliance Cheng Wing Gee College to boost mental well-being. The chatbot, particularly popular among younger visitors, engaged users in both written and verbal dialogue. Man-hei received valuable feedback from professionals and an invitation from YMCA staff to showcase “Aiya” at their AI project exhibition.

Teachers from various schools also offered suggestions and invited Man-hei to view their students’ demonstrations and urged them to see his. “It’s a mutual learning experience and an exchange of ideas,” said Man-hei, who won the Bronze Award in the Senior Secondary Division.

“Little Elves”, a motion-sensing physiotherapist robot designed by a team from Fung Kai No 1 Secondary School, caught the attention of professional physiotherapists. “Their suggestions are invaluable in refining our design,” group member Yao Zi-lin said. He also enjoyed exchanging ideas with other teams and learning about different coding systems.

The HKSF offered family-friendly activities for parents and their children. Photo: Handout

The HKSF is more than just a grand stage for young I&T talent to showcase their prowess. It has triumphantly championed the integration of science and technology into everyday culture.

The event spotlighted six engaging, family-oriented interactive zones, offering a fusion of learning and fun and captivating parents and children alike as they delved into the activities. The event also featured advanced inventions from local science institutions, which drew enthusiastic crowds eager to pose for pictures next to them. The HKSF truly embodies the spirit of innovation and science.

Hong Kong Science Fair 2023-2024 winners

Most popular award winners

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