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US-China tech war: Huawei’s chip unit HiSilicon to see massive decline in 5G chip market this year

  • HiSilicon, which had 23 per cent of the 5G phone chipset market in 2020, is expected to see that share shrink to less than 5 per cent this year
  • MediaTek, which designs processors for mobile applications, is the major supplier to Chinese smartphone vendors like Xiaomi, Oppo and Vivo

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A chip designed by HiSilicon is displayed at the Huawei China Eco-Partner Conference in Fuzhou, China March 21, 2019. Photo: Reuters
HiSilicon, Huawei Technologies Co’s integrated circuit (IC) design unit, is expected to be the biggest loser in the 5G smartphone chipset market in 2021 as US company Qualcomm and Taiwan’s MediaTek expand their presence, according to a new research note published by Counterpoint.
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The Chinese chip firm had 23 per cent of the 5G phone chipset market in 2020, but it is expected to see that share shrink to less than 5 per cent this year. Its share of overall global smartphone chipsets, which includes 4G, is expected to shrink from 10 per cent in 2020 to about 3 per cent this year, dropping out from the top five players, according to Counterpoint.

The decline of HiSilicon’s business is a direct result of the US government’s tightened sanctions last summer, barring semiconductor companies from supplying Shenzhen-based Huawei with chips made using US technology without prior approval, effectively severing the Chinese telecom giant’s access to advanced semiconductors.

Huawei did not immediately reply to a request for comment.

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HiSilicon was responsible for designing the Kirin processors for Huawei‘s smartphones. However, as the company has no chip manufacturing capacity of its own, it outsourced wafer fabrication to foundries like Taiwan Semiconductor Manufacturing Co (TSMC). But under the tighter US sanctions, HiSilicon can no longer do business with TSMC or other foundries because they all rely to some extent on core US technology to make wafers.

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