Nakamura Choukou sharpens edge in high-precision parts and cutting tools
Company seeks to promote its environment-friendly silicon sludge recycling technology to customers on the mainland from Shanghai sales office
Asia’s solar energy market continues to flourish, with China driving the region’s solar revenue growth. Responding to the industry’s fast-changing technological and business landscape, Nakamura Choukou is solidifying its market presence through its diamond-applied technology.
“Traditionally, silicon ingots for solar cell production are sliced into wafer form using loose abrasive grain, which is less efficient,” says Dr Makoto Inoue, president. “With our fixed-grain diamond wire cutting tool, we can achieve the highest wafer quality at a better price point.”
The company’s diamond wire DINA-PRISM has diamond abrasives firmly fixed to a fine wire. Compared with conventional cutting tools, DINA-PRISM is easy on the environment as it does not use slurry, cuts twice as fast, and has a longer wire lifespan. DINA-PRISM can be customised to suit the slice processing requirements for various electronic materials such as silicon for solar batteries and sapphire for light-emitting diode substrates.
Nakamura Choukou provides silicon wafer slicing services through affiliate company Suminoe Nakacho Device Technology, which is also engaged in the reprocessing of silicon sludge waste into usable raw materials for other industries such as ceramics.
The company has a sales office in Shanghai, where it mainly serves local solar battery manufacturers. Targeting its existing customers on the mainland, it seeks to promote its environment-friendly silicon sludge recycling technology approved by Japan’s New Energy and Industrial Technology Development Organisation.
