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Biden takes a last aim at China’s hi-tech ambitions with new chip restrictions
Sweeping rules target Chinese access to US-origin and foreign-made products using high-bandwidth memory technologies
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Washington has unveiled sweeping new regulations aimed at curbing China’s ability to develop advanced semiconductors critical to military technologies, artificial intelligence and hi-tech weaponry.
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The measures, announced on Monday by the US Commerce Department’s Bureau of Industry and Security, impose export restrictions on 24 types of chipmaking equipment and three categories of software essential for semiconductor development.
A significant focus is superfast high-bandwidth memory (HBM) – seen as vital for AI systems and other advanced computing tasks – with restrictions on the export of US-origin and foreign-made HBM to China in an attempt to prevent Beijing from expanding its AI capabilities in military applications.
The updates included revisions to the foreign direct product rule, which allows the US to inspect products manufactured outside its borders if they contain American technology.
One rule targets semiconductor manufacturing equipment destined for mainland China or Macau.
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Another restricts the foreign-made goods that can be sent to companies on the Commerce Department’s entity list, which includes organisations linked to China’s military or to alleged human-rights violations.
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