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China’s YMTC makes world’s most advanced memory chip in ‘surprise technology leap’: TechInsights report

  • YMTC advance follows on from TechInsights analysis of Kirin 9000S 5G chip found in Huawei’s Mate 60 Pro smartphone released in August
  • YMTC memory chip, found in a solid-state drive, shows firm has continued to develop advanced technology despite being hampered by sanctions

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YMTC has made surprise tech breakthrough with memory chip, says TechInsights. Photo: Handout

Yangtze Memory Technologies Co (YMTC), China’s leading memory chip producer, has manufactured the “world’s most advanced” 3D NAND memory chip known to be in a consumer device in a “surprise technology leap”, according to a report by TechInights.

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YMTC’s memory chip, found in a solid-state drive launched quietly in July, shows that the manufacturer has continued to develop advanced technology despite being hampered by sanctions after it was placed on the US Commerce Department’s Entity List, according to a Wednesday report by the semiconductor analysis firm.

The development follows an earlier teardown analysis by TechInsights of the Kirin 9000S 5G processor found in US-blacklisted Huawei Technologies’ Mate 60 Pro smartphone released in August, which was said to be made by Chinese foundry Semiconductor Manufacturing International Corp (SMIC). The powerful home-grown chip surprised many industry analysts given the tough US restrictions in place.

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“Like the innovation revealed by TechInsights in the Huawei Mate 60 Pro’s HiSilicon Kirin 9000s processor (which used the SMIC 7-nm (N+2) process), evidence is mounting that China’s momentum to overcome trade restrictions and build its own domestic semiconductor supply chain is more successful than expected,” said TechInsights in its report.

YMTC’s 64-layer 3D NAND Flash memory wafer. Photo: Handout
YMTC’s 64-layer 3D NAND Flash memory wafer. Photo: Handout
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